Analysis Of Cracks In Flat Screen Printing Machine Factory

The key reason for the cracking of the ink layer on the surface of the substrate after Hot Air Stenter Machine printing is due to the effect of the solvent and the great temperature change.

The key reason for the cracking of the ink layer on the surface of the substrate after Hot Air Stenter Machine printing is due to the effect of the solvent and the great temperature change. Generally, butadiene crafts use ethanol and crude oil-based solvents and weak solvents to cause cracks. Some substrate materials can also cause cracks due to their own elements.

In order to avoid the occurrence of cracks, the Flat Screen Printing Machine Factory must consider the characteristics of the printing ink and the solvent resistance of the substrate when using solvents. Raw materials with strong solvent resistance and abrasion resistance can be used as the raw materials of the substrate. Pay attention to maintaining the temperature balance in the production workshop. In multi-color overprinting, make each color package dry enough after printing, and strictly control the dry temperature. Generally speaking, by paying attention to the left and right aspects, the cracking of the ink layer can be manipulated reasonably.